QFN is a leadless package, which is rectangular or rectangular. Similar to chip level package (CSP), it is processed by cutting machine. There is a large area of exposed pad at the center of the bottom of the package for heat dissipation. There is a conductive pad for electrical connection on the periphery of the package with the large pad. QFN packages do not have gull-wing leads like traditional SOIC and TSOP packages, therefore， the conductive paths between internal pins and pads is very short, and low inductance and supplier resistance of wiring resistance within the package, which can provide prominent electrical performance. Additionally, it offer excellent thermal performance through exposed leadframe pads with direct thermal paths for heat dissipation within the package，Typically, thermal pads are soldered directly on the board, and thermal vias in the PCB help spread excess power dissipation into the copper ground plane, which absorbs excess heat. Due to its small size and light weight, coupled with outstanding electrical and thermal properties, this package is ideal for any application where size, weight and performance are critical.
QFN is defined by the Japan Electronic Machinery Industry Association, which is the abbreviation of QuadFlatNo-lead Package in English; DFN (DualFlatNo-lead Package) package belongs to the extension package of QFN package. The pins of the DFN package are distributed on both sides of the package body and the overall appearance is rectangular, while the pins of the QFN package are distributed on the four sides of the package body and the overall appearance is square. View more PCB package types.
What Types Of PCB Packages Are There?
- SMT Package
- PGA Package
- BGA Package
- DIP Package
- LCC Package
- QFN Package
- QFP Package
- CSP Package
The Importance Of PCB Package.
Nowadays, technology has been integrated into people’s daily life to a large extent. Televisions, computers and cell phones provide people with easy access to information and entertainment. Most devices have a printed circuit board (PCB) in their internal design to keep the device functioning properly, and good packaging technology improves the stability of the PCB function. PCB packaging serves as the final stage of a printed circuit board (PCB). In this process, semiconductor electronic components such as various capacitors, resistors, and various functional chips are packaged in the PCB board to protect the IC from potential external irresistible elements and the corrosive effects of aging. To put it simply, the package is a protective shell. Its main function is to transmit the signal to the electric melting point of the circuit board of the electronic device while protecting the module, so as to realize the stable operation of the function of the PCB board.
Its main functions are as follows:
- The size of the board can be reduced;
- Optimize the stability of the PCB circuit;
- It is beneficial to control the impedance of the circuit;
- Provide high-density interconnection;
- Multifunctional design can be realized.
Package Process Considerations.
People rely on technology, but pay little attention to what it is made of, such as circuits, low-loss materials and many other components that enable devices to run smoothly. Just as people depend on devices, devices depend to a large extent on their components. Therefore, in order to choose the right PCB for your PCB project, IC packaging must first understand the technical information of various design considerations in the PCB packaging production process, such as: material composition, substrate and reasonable design.